OPC work flow

 
what is OPC? 
Optical Proximity Correction (OPC) is a process used in the semiconductor industry to improve the accuracy of photolithography in the manufacturing of integrated circuits. The OPC workflow typically involves the following steps:
Layout Design: The first step is to create a layout design of the integrated circuit using computer-aided design (CAD) tools.
Simulation: The layout design is then simulated using specialized software to predict the physical behavior of light during the lithography process.

Model-Based OPC: Based on the simulation results, a model is created that predicts the distortions and aberrations in the lithography process. This model is used to adjust the layout design to compensate for these distortions.
Mask Generation: The modified layout design is used to generate a mask, which is used to transfer the circuit pattern onto the semiconductor wafer.
Lithography: The mask is used to expose the photoresist on the semiconductor wafer to light, creating the desired pattern.
Inspection: After the lithography process, the wafer is inspected to ensure that the pattern is correctly formed and that there are no defects.
Verification: The final step is to verify that the integrated circuit meets the desired specifications and performance requirements.
By using this workflow, the accuracy and yield of the integrated circuit can be improved, leading to higher quality and more reliable products.

OPC work flow
 
how OPC works?