Normalized Image Log Slope (NILS) is a metric used to evaluate the image quality of lithographic masks, which are used in semiconductor manufacturing to transfer circuit patterns onto silicon wafers.
NILS is a measure of the contrast of an aerial image of a mask pattern, which is the image of the pattern that is formed in the air above the mask when it is illuminated by light. It is calculated as the slope of the log of the image intensity versus the log of the spatial frequency of the pattern.
A higher NILS value indicates better image contrast, which is desirable for ensuring accurate pattern transfer onto the wafer. The NILS metric is often used in conjunction with other metrics such as line width roughness and pattern fidelity to evaluate the overall quality of a lithographic mask.
NILS can be affected by various factors such as mask pattern design, mask material, and the lithography process used. Therefore, it is important to carefully control these factors to optimize NILS and ensure high-quality pattern transfer during semiconductor manufacturing.
Mask Enhancement Error Factor (MEEF) is a metric used in semiconductor manufacturing to quantify the impact of mask pattern fidelity on the final printed image on a semiconductor wafer. It is a measure of the change in the critical dimension (CD) of a pattern on the wafer due to a change in the CD of the corresponding pattern on the mask.
MEEF is defined as the ratio of the change in CD on the wafer to the change in CD on the mask, both due to a small variation in the CD of the mask pattern. A higher MEEF value indicates that a small change in the mask pattern CD has a larger impact on the final CD on the wafer, which can lead to reduced pattern fidelity and lower device performance.
MEEF is an important metric for evaluating mask quality and process control in semiconductor manufacturing, as it helps to identify areas where improvements can be made to ensure better pattern fidelity and device performance. Mask manufacturers and semiconductor fabs often use MEEF as a key performance indicator and work to minimize its value through careful mask design and manufacturing processes.
MEEF can be affected by various factors such as mask material, mask pattern design, and lithography process parameters. Therefore, it is important to carefully control these factors to optimize MEEF and ensure high-quality pattern transfer during semiconductor manufacturing.
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